In the commercialization process of 5G, fields such as equipment, aviation, automation, automobiles, electronic and electrical instrument components, PCB boards and IC chips have put forward higher requirements for the reliability of devices. The traditional air-air temperature shock has gone out of date, becoming not well enough to meet the reliability verification of products. This means rigorous methods with less conversion time and more drastic temperature changes are in need by these industries to screen products with reliable performance.
Test Cycle:
Depend on relevant standards and test conditions specified by the customer (calculated by hour)
Product Scope:
Electronic and electrical products, such as on-board module, equipment electronics and IC chips
Test Items:
S/N
|
Test Items
|
Sample Number |
Test Method
|
1 |
Thermal Shock |
As requested by customer
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JESD22 B106、MIL-STD-202 Method 107、GJB128A: 1056, etc. |