Due to the substandard welding process of the product or its solder joints during the production, assembly and use, a number of problems such as cracking, welding cracks and device delamination would appear under the action of various stresses, which would directly affect the normal use of the product in serious cases.
Test Cycle:
3 to7 working days, emergency services are available
Product Scope:
PCB
PCBA
Test Items:
Test Items |
Test Method and Standard |
Sample Requirements |
Microsection |
IPC TM 650 2.1.1 |
Provided by the customer |