The one-time screening projects and stress conditions conducted by component manufacturers can hardly meet the needs of equipment development; besides, there are often some industrial or medium and low-grade products and even possibly fake and substandard products in imported components, which makes it hard to ensure the quality and reliability of electronic equipment.
Test Cycle:
2-4 weeks, during which comprehensive screening and testing services for electronic components will be provided; and urgent services are available.
Product Scope:
resistor; capacitor; magnetic bead; inductor; transformer; crystal oscillator; crystal resonator; relay; semiconductor discrete devices (diode, triode, FET, Darlington array, semiconductor optoelectronic device, etc.); electric connector; switch and panel elements; semiconductor integrated circuit (time base circuit, bus transceiver, buffer, driver, level translator, gate device, trigger, LVDS line transceiver, operational amplifier, voltage regulator, voltage comparator, power chip (voltage regulator, switching power converter, power monitor, power management, etc.), digital to analog converter (A/D, D/A, SRD), memory, programmable logic device, single chip microcomputer, microprocessor, controller, etc.); filter; power module; IGBT, etc.
Test Items:
S/N |
Test Items |
Sample Quantity |
Test Method |
1 |
Visual inspection |
As requested by customer |
GJB128, GJB548, etc. |
2 |
Electrical performance test:
Normal temperature test/high temperature test/low temperature test
|
As requested by customer |
GB or GJB test method
GJB33、GJB63、GJB65、GJB1042、GJB1432、GJB1648、GJB2438、GJB2138、GJB597、
…… |
3 |
Environmental/mechanical stress test:
frequency sweep/random vibration, low temperature storage, high temperature storage, temperature cycle, temperature shock, constant acceleration or drop, sealing (coarse leak detection, fine leak detection), PIND
|
As requested by customer |
GJB360、GJB128 、GJB548、
GJB33、GJB63、GJB65、GJB1042、GJB1432、GJB1648、GJB2438、GJB2138、GJB597、
…… |
4 |
Life/aging/burn-in |
As requested by customer |
GJB360、GJB128、GJB548 |
5 |
Ultrasonic testing of chip bonding |
As requested by customer |
GJB548 |
6 |
X-ray radiography |
As requested by customer |
GJB360、GJB128、GJB548 |